Building on this strong foundation of quality and innovation, SaiGon Fabrication turned its focus to one of the most pressing challenges- improving the repair process for UFPGA components. Their journey to improve the repair of UFPGA components began with the recognition of handling one of the most complex and sensitive components in electronics. These chips, known
for their complexity and sensitivity, contain 2,597 solder balls per Fine-Pitch Ball Grid Array (FBGA) and are 4mm thick. Unfortunately, their traditional BGA rework process was yielding inconsistent results, with a success rate lingering at just 40%. The challenges ranged from weak solder joints and misalignment to excessive heat exposure, which not only threatened product reliability but also affected production efficiency and increased costs.
Determined to find a better approach, SaiGon Fabrication set out to rethink the UFPGA repair process. Instead of relying on conventional BGA rework stations that apply concentrated heat to a single component, the team asked whether UFPGA repair could be integrated into a fully automated SMT process. This was an ambitious goal, as rework tasks, known for requiring exceptional precision are traditionally performed manually or semi-manually. Nevertheless, the team believed that leveraging their existing SMT production line would enable automation, precision, and consistency in repairing these components.
The first hurdle was tackling the solder paste application method. Standard stencil printing was not viable due to the fine pitch and uneven thickness of the component, which produced uneven solder deposition and weak joints. To address this, the team engineered custom mini stencils of varying thickness, specifically 2 mils, 3 mils & 4 mils, with carefully designed square openings and rounded corners to ensure precise solder application.
Even with this advancement, accurate placement of the UFPGA on the board remained a challenge. Manual positioning often led to misalignment and soldering defects. The breakthrough came when SaiGon Fabrication integrated an automated Pick-and-Place
machine into the repair process, ensuring 100% precise alignment of the UFPGA before reflow. Heat control was the next critical challenge. Traditional BGA rework machines focus intense heat on a single component, often damaging nearby parts. Instead, the team introduced a controlled reflow oven that ensured the UFPGA reflowed perfectly without overheating surrounding components. To further protect sensitive parts during reflflow, they also developed specialized protective pallets that shield critical areas while allowing optimal heat distribution during UFPGA repair.
The results were nothing short of astonishing. With this fully integrated automated UFPGA rework process in place, SaiGon Fabrication's success rate soared from 40% to 100% level. The process now features Stencil printing using custom-designed mini stencils for precise solder deposition, Automated Pick-and-Place placement for perfect alignment, Controlled reflow in an
oven to ensure uniform heat distribution and advanced quality control methods like X-ray, AOI, Dye & Pry Analysis, Cross Section, Flying Probe Test and Final Functional Testing.
This transformation is more than just an improvement; it has redefined the standard for UFPGA and BGA component repair and the impact has been profound. By eliminating repeated rework, Saigon Fabrication has significantly reduced material waste and saved valuable production time. The single-pass reflow process ensures the longevity of the UFPGA and adjacent components by
preventing overheating, which is a common risk with traditional methods. Furthermore, by leveraging the existing SMT infrastructure instead of investing in costly BGA rework stations, the company has achieved substantial cost savings. This innovative approach has also proven scalable, extending beyond UFPGA repairs to become the new standard for automated rework of
all BGA components.
SaiGon Fabrication's journey has not only solved a pressing factory issue but has also paved the way for smarter, more efficient electronics repair methods. The company proudly share their first innovation with the electronics community as a contribution to more sustainable repair solutions that reduce electronic waste. This success was made possible by the dedicated efforts of the team, including Mr. Peter Huynh (General Director), Mr. Thai (Engineering Manager), Mr. Quan (ME Supervisor), Mr. Lam (PE Supervisor) and many others. Together, they have raised the bar for repair efficiency and reliability, demonstrating that automation can make repair as precise and dependable as new assembly. This transformation was firmly rooted in industry best practices, particularly the globally recognized IPC standards, which played a crucial role in guiding the rework strategy. As an active IPC member, SaiGon Fabrication leveraged this affifiliation to stay aligned with the latest industry standards and insights. By adhering to these standards, SaiGon Fabrication was able to implement consistent, high-quality repair processes that align with best-in-class manufacturing practices.