Saigon Fabrication successfully transformed its UFPGA repair process - originally a manual and error-prone procedure -into a fully automated SMT solution. Previously, manual BGA repair methods yielded only a 40% success rate and posed risks of recurring failure.
By working closely with the engineering teams, the company developed a precise, thermally controlled, and fully automated rework process tailored for high-density BGA components like UFPGA. This innovation resulted in a 100% repair success rate, reduced rework cycles, and significantly improved product reliability.
Importantly, the upgraded process meets IPC global standards, marking a key step in Saigon Fabrication’s commitment to advanced manufacturing, quality, and continuous improvement in electronic assembly services.